项目 |
加工能力(括号内为公制) |
备注 |
最大拼版尺寸 max panel size |
27"x20"(686mm x508mm) |
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内层最小线宽/线距 innerlayer line width/space(min) |
3mil/3mil(100um/100um) |
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最小内层隔离环宽 min innerlayer clearance |
5mil(0.13mm) |
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最小内层焊盘 min innerlayer pad |
5mil(0.13mm) |
指焊环宽 |
最薄内层厚度 min core thickness |
4mil(0.1mm) |
不含铜箔 |
最小绝缘层厚度 min dielectric thickness |
3mil(76um) |
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内层铜箔厚度 thickness of inner copper |
1/3oz、1/2oz、1oz、2oz(12um、17um、35um、70um) |
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外层底铜厚度 thickness of outerlayer base copper |
1/3oz、1/2oz、1oz、2oz(12um、17um、35um、70um) |
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完成板厚度 thickness of finished panel |
0.20-4.0mm |
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完成板厚度公差tolerance of finished panel thickness |
板厚<1.0mm |
±12% |
4-8层板 |
1.0mm≤板厚<2.0mm |
±8% |
4-8层板 |
内层表面处理工艺surface treating technic of innerlayer |
黑/棕氧化 |
|
层数layer number |
1~40 |
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多层板层间对准度registration of innerlayer to innerlayer |
±3mil(±76um) |
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最小钻孔孔径 min drilling diameter |
0.20mm |
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最小完成孔径 min diameter of finished hole |
0.10mm |
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孔位精度 accuracy of hole position |
±2mil(±50um) |
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槽孔公差 tolerance of drilled slot |
±3mil(±75um) |
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镀通孔孔径公差 tolerance of PTH diameter |
±2mil(±50um) |
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非镀通孔孔径公差 tolerance of NPTH diameter |
±1mil(±25um) |
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孔电镀最大纵横比 max A.R. of PTH |
10:01 |
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孔壁铜厚度 PTH hole copper thickness |
0.4-2mil(10-50um) |
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外层图形对位精度 image to image tolerance |
±3mil(0.075mm) |
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外层最小线宽/线距 outer layer line width/space(min) |
4mil/4mil(100um/100um) |
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蚀刻公差 tolerance of line width |
±1mil(±25um) |
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阻焊剂种类 type of solder mask |
Taiyo PSR2000、新韩NSR-9000及其他 |
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阻焊剂厚度 thickness of solder mask |
线顶 |
0.4-1.2mil(10-30um) |
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线拐角 |
≥0.2mil(5um) |
基材上 |
≤完成铜厚+1.2mil |
阻焊剂硬度 hardness of solder mask |
6H |
|
c |
±2mil(50um) |
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阻焊桥最小宽度 min solder mask dam |
3.0mil(75um) |
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塞油最大孔径 max solder mask plug hole diameter |
0.5mm |
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表面处理工艺 surface treating technics |
HASL、插指镀金、全板镀金、OSP、ENIG |
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金手指最大镀镍厚度 max nickle thickness of gold finger |
280u″(7um) |
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金手指最大镀金厚度 max gold thickness of gold finger |
60u″(1.5um) |
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沉镍金镍层厚度范围 range of nickle thickness for electroless nickle and immersion gold |
120u″/240 u″(3um/6um) |
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沉镍金金层厚度范围 range of gold thickness for electroless nickle and immersion gold |
2u″/6 u″(0.05um/0.15um) |
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外型最小公差 min routing dimension tolerance(edge to edge) |
±4mil(±0.10mm) |
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孔对边最小公差 min routing dimension tolerance(hole to edge) |
±3mil(0.075mm) |
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V槽角度 V-cut angle |
30°,45°,60°, 90° |
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刨斜边角度范围 range of bevel angle |
20°~60° |
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最小字符宽度/间距 min legend line width/space |
5mil/5mil(0.125mm/0.125mm) |
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线路抗剥强度 peel strength of line |
≥6lB/in(≥107g/mm) |
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离子污染 ionic contamination |
<1.0ugNaCl/cm2 |
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阻抗控制及公差 impedance control and tolerance |
50Ω±10% |
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翘曲度 bow and twist |
≤0.5% |
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板料种类 type of dielectric material |
94-HB、94-V0、22-F、CEM-1、CEM-3、FR-4、无卤素材料、Tg170℃ FR-4、高CTI材料,耐CAF材料、铝基、铜基 |
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其他特殊工艺other technics |
印碳油、印可剥离蓝胶,银浆灌孔 |
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